SMT Rework
BGA Rework Services
PSI knows solder, our staff has over 50 years experience reworking & reballing array devices. Specialty rework equipment conceptualized by, and manufactured for PSI, allows quick & accurate profiling of all assemblies up to 24″ x 24″ and 0.25″ thick.
BGA Reballing Services
Is reballing outside your sphere? Don’t stress – call the experts at PSI! With over 20 years experience reballing BGA devices of every size, pitch, and package style, PSI delivers consistent quality, low cost, and top notch service. PSI clients become very attached!
BGA Reclaim Services
Scrap is an unavoidable reality in electronics manufacturing, but there is still value in many of those BGA devices! When you send obsolete and scrap assemblies to PSI for BGA removal and reball, we turn scrap boards into good inventory.
BGA Alloy Conversion
Whether you’re building high reliability assemblies for military or aerospace, or just need to provision older Sn-Pb inventory for RoHS compliant applications, you can rely on PSI for BGA alloy conversions.
ECO Rework
Just say “no” to scrap. And re-spins. And missed deadlines. Forgot something on that prototype board? Let PSI’s experienced team accomplish your ECO modifications, while you avoid delays, respins and scrapped assemblies.
Coplanarity Lead Straightening
PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles.
SMT Rework & Repair
ur Rework, Repair and Reball operations turn bad parts and assemblies into good ones at a fraction of the time and cost of sourcing new material or manufacturing from scratch. In addition to BGA reballing and rework, PSI offers component reclaim, fine pitch lead refurbishment, precision cleaning, gold plating repair, PCB pad and trace repair, and more. We work closely with our clients to ensure we are providing the highest possible service levels. Outgoing quality is assured using real-time X-Ray equipment with 160kV power to see through virtually any product with remarkable resolution.
PSI will rework quantities ranging from one part or assembly to thousands. Call the surface attach experts at PSI the next time you have any of the following rework needs:
- BGA/LGA/QFN Rework Services
- Any size assembly
- BGA interposer modules/ sockets/ connectors
- All BGA packages: plastic overmold, metal heat spreader, CSBGA, stacked (PoP) modules
- Ceramic Column Grid Arrays (CCGA)
- Ceramic Ball Grid Arrays (CBGA)
- Micro BGA’s down to .25 mm pitch
- Any alloy – SnBi, Sn63Pb37 eutectic, Sn90Pb10 (high temp), and SAC305
- Hand soldering of Passives & PTH
- ECO modifications to PCBs, including under BGA
- IPC-A-610, J-STD-001, IPC 7711/7721 standards compliance
BGA Reball
PSI regularly works with extreme cases and problem boards, with BGAs up to 10,000 solder connections, and pitches as small as 0.25mm. See our main reballing page for more information.
BGA Sockets / Connectors
PSI has developed processes for successful removal/ replacement & reballing of a myriad of connectors and sockets.A wide variety of BGA connectors and sockets are in use today.
Ceramic BGA or Column Grid Arrays
PSI can remove & replace ceramic array devices on small or large assemblies. PSI will reball your ceramic parts with high-temp solder spheres. Note: We do not offer re-columning services.
BGA Interposer Modules
BGA interposer modules can have many different configurations. Some are used to configure a BGA part that can be plugged into a pin grid array socket. Other modules combine functions on a small circuit card, and adapt to a BGA footprint on a mother assembly. PSI has helped pioneer the processes used for developing and reworking these modules. We assist with design for manufacture concerns, as well as rework process development needs, such as:
- Material selection
- Process flow for manufacturing
- Rework profile development
- Failure analysis or product qualification services via our analytical laboratory
Quality Matters
PSI inspects 100% of rework for conformity to IPC, JEDEC, and customer acceptability requirements. For array devices and bottom terminated components, off-axis X-ray verifies solder joint integrity. If you are not satisfied, we are not either.