PSI offers real-time, off-axis X-ray with three 160kV Nikon X-ray stations, perfect for inspecting PCBAs and array devices for failure analysis, validation, or screening. Five motion axes and 75 degree oblique viewing allows operators to visualize subtle and elusive defects.
Micro-sectioning is an analysis method used by PSI for failure analysis and process validation. Microscopic inspection of the target plane can reveal hidden defects, process indicators, or anomalies.
True 3D Computed Tomography (CT) X-ray allows PSI to visualize complex internal features. Common applications include virtual cross-sections, void characterization, root cause investigations, reverse engineering, and more.
PSI uses scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) capability easily identify microscopic features and elemental composition of your materials.
PSI has pioneered a comprehensive counterfeit detection and screening process that leverages our industry expertise in SMT failure analysis to help our clients keep counterfeit parts out of your supply chain.
IC Analysis is the preferred method for identifying surface contaminants on printed circuit assemblies. If you are concerned about board cleanliness, we can help!
Our lab is equipped to answer a range of SMT analysis challenges, such as root cause failure analysis, SMT process validation, material qualification, material analysis, and more.
Our dye penetrant test is a reliable method for detecting open solder joints under bottom-terminated SMT components. failure analysis and process validation.
Verify plating thickness on PCBs using X-ray Fluorescence, for ENIG, ENIPIG, HASL, Silver, Gold, and other common finishes.
The C3 ionic cleanliness tester is the only system that allows localized extraction, for spot testing specific locations on your assembly for corrosivity of residues.
Our analytical services laboratory is dedicated to helping clients in the electronics circuit assembly and semiconductor industries. Our extensive analytical capabilities allow us to promptly identify issues and develop solutions that enable our customers to keep their projects on track.
ailure analysis can take you in many directions, with widely varying costs and results. It helps to have a partner who can help navigate the many options available, and weigh the benefits of each. By outlining an analysis strategy that narrows the potential root causes, minimizes cost, and preserves your sample(s) for future analysis when possible, PSI can help you get to the bottom of your investigation quickly and efficiently, with meaningful results. PSI offers:
While PSI specializes in failure analysis, we also use X-ray inspection, microsectioning, dye & pry test, and other means to confirm SMT processes, and bring to light anomalies, process indicators, and defects. With over 75 combined years experience in SMT problem solving, our staff of knowledgable analysts, technicians, and engineers can help you overcome any SMT challenge.
There are no defects under this BGA, but a process problem is clearly evident. Typical solder joints are spherical or ovoid, however a large number of the joints in this video look like an hourglass. This shape can result from either a high standoff height, or from significant variations in solder volume. In the above case, these skinny-waisted solder joints seem randomly distributed, not clustered together as typical with warping or coplanarity issues. These variations in shape appear to be due to variations of solder volume.
Variations in solder volume can have various causes, such as paste print variations, missing mask, or BGA component problems. For example, when there is damaged or missing mask, molten solder can wick along the trace during reflow, and sometimes even down a via. (It is not uncommon for the entire solder joint to be “lost” in this way.) However, neither stray solder nor filled vias are evident in this video, so it’s clear that we are not witnessing solder migration; instead the “missing” solder probably resulted from variations in the paste print. This customer should review their paste storage and handling practices, their stencil design, equipment, and printing procedures, to see why paste was not uniformly distributed prior to BGA placement.