ross sections reveal defects and features of circuit assemblies that may not be detectable or measureable using non-destructive methods such as X-ray, CT, or optical inspection. Microsectioning shows intermetallic (IMC) layers, solder defects, and other physical characteristics of surface mount devices, such as BGA’s, LGA’s, and bottom terminated QFP’s, as well as PCB inner layers and construction. PSI uses microsection for both failure analysis and validation of assembly processes.
PSI works with you to determine the ideal plane(s) for sectioning, taking into account board characteristics, failure mode, and X-ray observations. Wherever possible, additional planes of interest are preserved for potential future investigation. Samples are excised from the board, potted in a special epoxy, then polished and etched to expose the desired plane. PSI’s experienced technicians use a carefully refined polishing process to yield a smooth finish that preserves fine details, such as grain structure and intermetallic layers, and minimizes scratches and artifacts.
