Services

PSI offers real-time, off-axis X-ray with three 160kV Nikon X-ray stations, perfect for inspecting PCBAs and array devices for failure analysis, validation, or screening. Five motion axes and 75 degree oblique viewing allows operators to visualize subtle and elusive defects.

Micro-sectioning is an analysis method used by PSI for failure analysis and process validation. Microscopic inspection of the target plane can reveal hidden defects, process indicators, or anomalies.

True 3D Computed Tomography (CT) X-ray allows PSI to visualize complex internal features. Common applications include virtual cross-sections, void characterization, root cause investigations, reverse engineering, and more.

PSI uses scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) capability easily identify microscopic features and elemental composition of your materials.

PSI has pioneered a comprehensive counterfeit detection and screening process that leverages our industry expertise in SMT failure analysis to help our clients keep counterfeit parts out of your supply chain.

IC Analysis is the preferred method for identifying surface contaminants on printed circuit assemblies. If you are concerned about board cleanliness, we can help!

Our lab is equipped to answer a range of SMT analysis challenges, such as root cause failure analysis, SMT process validation, material qualification, material analysis, and more.

Our dye penetrant test is a reliable method for detecting open solder joints under bottom-terminated SMT components. failure analysis and process validation.

Verify plating thickness on PCBs using X-ray Fluorescence, for ENIG, ENIPIG, HASL, Silver, Gold, and other common finishes.

The C3 ionic cleanliness tester is the only system that allows localized extraction, for spot testing specific locations on your assembly for corrosivity of residues.

Process Sciences specializes in the rework of BGA, LGA and QFN devices, BGA connectors, and various styles of bottom terminated SMDs.

Is reballing outside your sphere? Don’t stress – call the experts at PSI! With over 20 years experience reballing BGA devices of every size, pitch, and package style, PSI delivers consistent quality, low cost, and top notch service. PSI clients become very attached!

Scrap is an unavoidable reality in electronics manufacturing, but there is still value in many of those BGA devices! When you send obsolete and scrap assemblies to PSI for BGA removal and reball, we turn scrap boards into good inventory.

Whether you’re building high reliability assemblies for military or aerospace, or just need to provision older Sn-Pb inventory for RoHS compliant applications, you can rely on PSI for BGA alloy conversions.

Just say “no” to scrap. And re-spins. And missed deadlines. Forgot something on that prototype board? Let PSI’s experienced team accomplish your ECO modifications, while you avoid delays, respins and scrapped assemblies.

PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles.

The SMT Master Course was designed to provide in-depth practical process understanding to those individuals interested in ensuring quality in electronic assemblies.

Process Sciences’ comprehensive X-ray inspection training class leverages X-ray technology to help your SMT inspection and quality personnel improve quality and quickly diagnose problems.

PSI maintains a reservoir of talented and experienced consultants. Our staff consultants specialize in SMT process troubleshooting, training initiatives, cleaning and soldering challenges, specification and development of new processes and equipment.