rocess Sciences, Inc. (PSI) is an SMT process engineering resource center and solutions company. Many OEMs, contract manufacturers, and hardware development teams rely on PSI for BGA reballing, circuit assembly rework and repair services, X-ray inspection, failure analysis, SMT process validation, and more. Outsourcing these services to PSI allows our clients to focus on designing and producing reliable electronics, which has made Process Sciences a sought after resource in the circuit assembly and semiconductor industry since 1994.
PSI aims to provide timely and cost-effective solutions to assembly process challenges, so our clients can focus on designing and producing reliable electronics.
When you select PSI, your satisfaction is our top priority. PSI inspects 100% of outgoing rework orders using off-axis X-ray and/or visual microscopy. Even when yields cannot be guaranteed, as is the case with engineering changes, reballing, or assembly rework, PSI does not charge our clients for scrap. If any deficiencies are discovered in PSI workmanship, we will quickly make it right. In our laboratory, analysis reports are peer-reviewed to provide the most accurate and meaningful findings for your investigation, and a follow up consultation is always available. PSI meets the rigorous quality standards of AS9100D and ISO 9001:2015.
We understand how precious your assemblies and components are to your business. That's why PSI facilities are ESD safe, with all employees and workbenches grounded, and static dissipative flooring throughout. It's why all your goods - parts, boards, and even the ship carton - are tracked and labeled with your unique order number from initial check-in to final shipment, so that no part of your order becomes "orphaned." And it's why all goods submitted for rework are first baked for moisture removal (unless received in dry-pack), and all thermal processes carefully monitored. To secure your goods, PSI storage areas are protected by alarm and closed circuit camera. Operations and Quality management systems are up-to-date and closely followed, to ensure consistent and reliable results month after month.
PSI can turn an order for a single component analysis, or rework of 10,000 assemblies. Our competitive pricing is affected by many factors such as quantity, lead time, board & part characteristics, special handling or packaging requirements, etc. For this reason, every unique order is quoted independently. A typical rework order usually takes a week for standard turn, and lab orders about eight business days, with expedited service available for a premium. Turnaround time for large orders becomes a question of throughput, and fortunately PSI is flexible and able to ramp up production when needed. Please call to discuss your requirements!
Process Sciences, Inc. was founded as an independent analytical lab by Steve Stach & Stephen Schoppe in 1994. PSI has always been focused on supporting the electronics manufacturing industry with services that facilitate materials and process failure analysis. Initial customers included IBM, Motorola & Texas Instruments, all of which were engaged in high volume manufacturing of electronics. Supporting customers in a manufacturing environment included screening of incoming materials like solder paste, circuit boards, and components, qualification of new processes and products, and failure analysis of vendor or process related problems. As manufacturing became less of the focus for domestic electronics manufacturers, PSI's service offering has migrated toward failure analysis for vendor disputes and customer returns.
Soon after starting the business, PSI customers began inquiring about services for reworking and reballing Ball Grid Array (BGA) components. PSI acquired a transmission X-ray machine to allow for inspection analysis of BGA's and pioneered processes for rework and reballing BGA's. Commercially available equipment for assembly rework processes was not capable of reworking BGA components on larger boards. PSI first adapted existing rework equipment with larger bottom-side preheaters to accommodate BGA rework challenges, eventually PSI partnered with a designer to develop a computer controlled BGA rework machine. Over the years PSI has adapted to rework challenges presented by shrinking geometries and increasing I/O. Today PSI routinely reworks BGA's with up to 2,900 I/O and pitches as low as 0.25mm.
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