Process Sciences, Inc

The Solder Experts!
Assembly Rework & Laboratory Services

BGA Rework & Reball

Your best resource for rework of array devices, ECO modifications, and BGA reball projects.


SMT Failure Analysis Laboratory

PSI specializes in surface attachment troubleshooting and validating assembly processes.


Off-axis X-ray Inspection

We find what others miss, with five motion axes, 75-degree oblique viewing angles, with 160kV power.


Component Reclaim Services

Scrap is an unavoidable reality in electronics manufacturing, but there is still value in many of those BGA devices! When you send obsolete and scrap assemblies to PSI for BGA removal and reball, we turn scrap boards into good inventory.

Microsection | BGA Analysis

Micro-sectioning is an analysis method used by PSI for failure analysis and process validation. Microscopic inspection of the target plane can reveal hidden defects, process indicators, or anomalies.