CT X-ray with 3D Volume Reconstruction
eal 3D X-ray with CT volume reconstruction allows 3D visualization and virtual cross sections of circuit assemblies, solder joints, and components. CT X-ray is the best tool for many applications, such as failure analysis investigations, reverse engineering, void analysis and defect visualization. Contact PSI today and see if CT X-ray is the right method for your analysis needs.
Nikon XTH-225 Electronics CT X-ray Inspection System
PSI's Nikon XTH-225 system with 3D volume reconstruction is specifically designed for inspection and 3D visualization of electronic assemblies and components. Boasting 225kV power and flexible fixturing, this powerful system can reveal miniature features and furtive anomalies with amazing clarity and perspective. The Varex 4343 High-Grade Amorphous-Silicon digital flat panel detector offers 2800 x 2880 pixel array (8.3 MegaPixel) resolution, with a 430 x 430 mm real-time field of view. CT X-ray can be performed destructively or non-destructively. However, for optimal scans of samples larger than a few inches, it is often necessary to excise the area of interest from the circuit assembly, in order to obtain the magnification and contrast necessary for a high quality scan. |
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Nikon XTV-160 Electronics CT X-ray Inspection System
PSI's Nikon XTV-160 X-ray system also allows inspection and 3D visualization of electronic assemblies and components. As the name suggests, a powerful 160kV source penetrates most circuits and modular electronics samples with ease. The Varian 1515DXT-I Detector is 1125x1152 (1.3 MegaPixel) resolution. Nikon's proprietary Xtract technology uses table rotation to allow X-ray scans of large, intact samples, with results that approximate those of conventional (axial rotation) scans, avoiding the destructive sample prep that is usually required larger samples. |
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Non-destructive 3D Imaging for electronics assemblies, for applications such as:
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Solder inspection or visualization of stacked BGAs (Package-on-Package, or PoP) and interposers
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Virtual Cross Sections on three axes
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PCBA failure analysis
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Reverse engineering circuit layout
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Visualization of complex designs and obscured elements
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Verify build quality
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Confirm uniform distribution of underfill, epoxy adhesives, solders
A selection of CT generated cross-sectional and 3D volume images...
| Watch a simulated flight through a 3D volume reconstruction of the Apple Watch Ultra (released 09/2022). For best viewing experience, we recommend full screen. CT X-ray scan performed on a Nikon XTH225 CT X-ray station, and 3D volume reconstructed using VGStudio Max from Volume Graphics. Music sourced from Pixabay. |
CT X-ray inspection service, 3D X-ray, virtual cross sections