Array Rework Services
PSI has over 8 years experience reworking & reballing array devices. Specialty rework equipment conceptualized by, and manufactured for PSI, allows quick & accurate profiling of all assemblies up to 24" x 24" and 0.25" thick. Our real-time X-Ray equipment provides 160 KeV of power to see through virtually any product with remarkable resolution. PSI will rework quantities ranging from one part/ assembly to thousands of parts/ assemblies.
PSI reworks:
- Ceramic Column Grid Arrays (CCGA)
- Ceramic Ball Grid Arrays (CBGA)
- BGA interposer modules/ sockets/ connectors
- Plastic & Metal top BGA's up to 2.5"x 2.5"
- Micro BGA's down to .5 mm pitch
- Lead-free BGA's
PSI Reballs:
- High-temp solder spheres
- Eutectic Tin/ Lead solder spheres
- Lead-free solder spheres
- BGA modules/ sockets/ connectors
BGA Sockets / Connectors 
A wide variety of BGA connectors and sockets are in use today. PSI has developed processes for successful removal/ replacement & reballing of a myriad of connectors and sockets.
Ceramic Ball or Column Grid Arrays
PSI can remove & replace ceramic array devices on small or large assemblies. PSI will reball your ceramic parts with high-temp solder spheres. We do not offer re-columning services.
BGA Reball
Parts with up to 2500 solder connections with pitches as small as 0.4mm are routinely reworked at PSI.
 
BGA Interposer Modules
BGA interposer modules can have many different configurations. Some are used to configure a BGA part that can be plugged into a pin grid array socket. Other modules combine functions on a small circuit card, and adapt to a BGA footprint on a mother assembly. PSI has helped pioneer the processes used for developing and reworking these modules.
PSI can provide the following services for BGA interposer modules:
Sphere attach to circuit laminate
- High temp solder spheres
- Eutectic tin / lead solder spheres
- Lead-free solder spheres
Manufacturing / reowrk process development
- Material selection
- Process flow for manufacturing
- Rework profile development
- Failure analysis or product qualification services are provided in our analytical laboratory
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