At PSI we've put together a
comprehensive couterfeit detection process that utilizes our Failure
Analysis equipment and expertise to ensure counterfeit parts stay
out of your supply chain.
At the heart of our counterfeit
detection process is the Nisene Jet Etch Automated Decapsulator.
The Nisene Jet Etch automatically dispenses heated acid (Sulfuric / Nitric) on the area of the package
that needs to be removed until the silicon die is exposed.
| Part
before decapsulation |
Die
exposed after decapsulation |
 |
 |
Sample Counterfeit Detection Report
"Counterfeiting accounts for more
than 8% of the global merchandise trade and is resulting in lost sales
of $600B and is expected to grow to $1.2T by 2009." -US Department of
Commerce
What is a counterfeit electronic
part?
- A part whose identity (e.g.
manufacturer, part number, date code, lot code) has been deliberately
misrepresented.
- Copied (reverse engineered)
parts that may not perform to OCM specifications.
- Used parts that are recycled
and sold as new.
- Defective parts sold as new
or working used parts.
- Fake parts that do not
function (e.g. incorrect die or no die at all)
A few real world examples of Counterfeit Electronic Parts
| Case 1: Black topped / remarked part |
Case 2: Incorrect Silicon Die |
 |
 |
 |
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Case 1: Black topped /
remarked part; During visual inspection is was noticed that the part
had been black topped (top picture). Upon removal of the black top
material; the original part markings were uncovered. (bottom picture)
Case 2:Incorrect
Silicon Die; Two sample parts with same OCM part number, date and lot
code were sent in for analysis. When the parts were decapsulated
we discovered they contained completely different silicon dice.
Although an engineering change to the OCM's part number could be
the reason for a different die, production protocol requires a change
in lot code.
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