With the increased use of BGA ,
flip-chip, and leadless devices, circuit assemblers need
something other than traditional top down X-Ray to screen
for defects such as opens, insufficient solder, and voiding. The X-Tek Revolution is designed specifically for use on production lines and in
failure analysis laboratories. Intuitive software allows operators to visualize
the most demanding defects.
The video below demonstrates how these defects are easily detected with
our state of the art X-Tek Revolution Real Time X-Ray machine.
The X-Tek
Revolutiuon is also equipped with software that does Real Time
Void and PTH Fill Analysis.
The BGA Void
function allows for the analysis of voiding within arrays of pads or
individual solder balls. The analysis will count the number of voids,
and the percentage of the
balls area that consists of voids for each complete solder ball in the
X-ray image
The Package Void function is
ideally suited to the calculation of voids within a die attached to a
chip carrier. It highlights the voids and calculates what percentage
the voids form of the whole die attach.
The PTH (Plated Through Hole)
Fill Analysis function allows for the analysis of fill level within
plated through holes.
